Vorbestellungszeitraum: 30. Dezember 2025 bis 30. Januar 2026
Voraussichtliche Lieferung: Q2 2026
KBDFans
KBDFans Tofu60 3.0 - 60% Mechanical Aluminium Keyboard Kit [Preorder]
🧩 TOFU60 3.0 – Die Ikone, neu definiert
Die TOFU60 3.0 ist die jüngste Evolution eines der bekanntesten 60%-Keyboard-Kits der Custom‑Szene. KBDfans hat das ikonische Design nicht nur modernisiert, sondern technisch auf ein neues Niveau gehoben. Das Ergebnis ist ein kompromissloses, modular aufgebautes Premium‑Kit, das Enthusiasten maximale Freiheit beim Bauen und Tunen bietet.
✨ Design & Verarbeitung
- Gefertigt aus hochwertigem Aluminium (eloxiert, E-Coated oder RAW)
- Wahlweise Aluminium-, Edelstahl- oder Kupfer‑Bottom Case für unterschiedliche Gewichte und Looks
- Klare, zeitlose Linienführung mit verfeinerter visueller Sprache
- Erhältlich in WK, WKL und HHKB Layouts
Die TOFU60 3.0 bleibt der ikonischen Silhouette treu, wirkt aber moderner, präziser und massiver als ihre Vorgänger.
⚙️ Technik & Features
Flexible Mounting‑Optionen
- PCB Gasket Mount – weich, gedämpft, flexibel
- Optimierter Top Mount – klassisch, direkt, präzise
- Plateless‑Build möglich (mit Solder PCB) für ein besonderes Tippgefühl
Integriertes Force‑Break‑System
Reduziert Case‑Ping und verbessert die akustische Performance ohne zusätzliche Mods.
PCB‑Optionen
- Solder PCB (ISO + ANSI)
- Hotswap PCB (ISO + ANSI)
- Dual‑Mode Hotswap (Kabel + Bluetooth, ISO + ANSI)
- HE PCB (Hall‑Effect, nur WK und ANSI - kein ISO möglich)
Alle PCBs unterstützen VIA/VIAL/AVA für maximale Anpassbarkeit.
Plates
Wähle aus Aluminium, Carbon Fiber, PC, PEI oder FR4 – jede mit eigenem Sound‑ und Flex‑Profil.
📦 Lieferumfang
- Top Case
- Bottom Case
- Optional: Weight Bars (Alu, Edelstahl, Kupfer)
- PCB (je nach Auswahl)
- Daughterboard
- Silicone Gaskets
- Rubber Feet
- Optional: Foam Kit
- Optional: Plate
- Carrying Case
⭐ Fazit
Die TOFU60 3.0 ist ein würdiger Nachfolger der legendären TOFU‑Reihe:
hochwertig, modular, akustisch stark und extrem anpassbar. Ein Board für Enthusiasten, die ein 60%-Kit suchen, das sowohl optisch als auch technisch auf dem neuesten Stand ist.
Wired PCB (Solder & Hot-Swap) Specifications
Wired PCB (Solder & Hot-Swap)
Dive into deep customization with support for AVA, VIAL, and VIA. The solder version also allows for a unique plateless build option.
- 1.6mm thickness
- FR4 material
- Solder version/ Hotswap version
- Magnetic connector PCB
- Json file:ydkb_kbdfans_tofu60_3_0_via.json
- Firmware: ydkb_kbdfans_tofu60_3_0_vial.uf2
Dual-Mode PCB (Bluetooth+Wired) Speficiations
Dual-Mode PCB
Experience the freedom of wireless with our first-ever dual-mode board powered by ZMK. Its ultra-low power consumption delivers an incredible 6+ months of battery life from a single 1000mAh battery.
- 1.6mm thickness
- FR4 material
- Hotswap version
- Magnetic connector PCB
Hall-Effect PCB Specifications
HE (Magnetic) PCB
Engineered for victory. We've partnered with NNKS to create a next-gen Hall Effect PCB focused on what matters most: ultra-low latency.
- New Daisy-Chain Architecture: Reduces input delay.
- Stable 0.01mm Resolution: Precision where it counts.
- Web-Based Configurator: Easy, on-the-fly adjustments.
- Continuous Firmware Updates: Always stay ahead of the curve.
TOFU60 3.0
The Icon, Refined
As the third evolution in the series, the Tofu60 3.0 strikes a perfect balance between heritage and innovation. Externally, it preserves the beloved minimalist contour of its predecessor, the Tofu60 2.0. Beneath the surface, however, the internal architecture has been meticulously reimagined. The Tofu60 3.0 is more than just a new design attempt; it is the definitive continuation of a classic.
Case Design
Craftsmanship & Finish
Expertly crafted, the Tofu60 3.0 case comes in two premium finishes. Choose the silky-smooth feel of sandblasted anodized aluminum or the fine, matte texture of our rich E-coating. Both perfectly highlight the case's clean, sculpted lines.
Structural Integrity
Internally, the Tofu60 3.0 carries forward the minimalist design heritage of the TOFU family while introducing a versatile dual-mounting system. This allows users to choose between a classic TOP Mount for a firm, responsive feel, or a PCB Gasket Mount for a softer, more flexible typing experience, catering to diverse preferences.
Visual Language
Visually, the Tofu60 3.0 introduces a bold design language. The bottom case features an exposed rear accent, splitting the USB port face into two distinct sections. This innovative construction enables striking two-tone color combinations, both immediately captivating and enduringly timeless.
Integrated Force Break System
The design includes custom-molded Force Break silicone pads. These pads create a buffer between case components, effectively dampening case vibration and eliminating unwanted metallic "ping," ensuring a cleaner sound.
Mounting Style
PCB Gasket mount
Engineered for Softness
Following a similar support distribution as the TOP Mount, the PCB Gasket is designed to provide a maximally soft, bouncy, and flexible typing experience.
Plateless Build Potential
Combine this mount with the solderable PCB to assemble your board without a plate. This "plateless" configuration is the ultimate choice for achieving maximum flex and a unique, deep sound profile.
Top mount
Optimized TOP Mount Structure
To minimize resonance and hollowness, the mounting points for the TOP structure are strategically placed to avoid the spacebar area. This results in a more uniform and satisfying sound signature.
Plate-Mount Silicone Dampeners
Silicone dampeners provide complete physical decoupling of the positioning plate from the upper housing. This design mitigates resonance conduction at its origin, significantly reducing structural noise
PCB Layouts
Solder, Wired and Dual-Mode PCB

